Enhancing power supply performance with the TPSM53604 power module

TPSM53604 offers improved power module efficiency, solution size, and thermal performance. Learn how in this brief training series.

Reducing power supply solution size has traditionally come at the expense of reduced efficiency and thermal performance. But with TPSM53604 and its routable lead frame (RLF) QFN packaging, this is no longer the case. See how you can leverage the TPSM53604 in your next design to buck the trend and set a new bar for power module size and performance.

Additional information

arrow-topclosedeletedownloadmenusearchsortingArrowszoom-inzoom-out arrow-downarrow-uparrowCircle-leftarrowCircle-rightblockDiagramcalculatorcalendarchatBubble-doublechatBubble-personchatBubble-singlecheckmark-circlechevron-downchevron-leftchevron-rightchevron-upchipclipboardclose-circlecrossReferencedashdocument-genericdocument-pdfAcrobatdocument-webevaluationModuleglobehistoryClockinfo-circlelistlockmailmyTIonlineDataSheetpersonphonequestion-circlereferenceDesignshoppingCartstartoolsvideoswarningwiki