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Innovations in DC/DC Buck Converter Packaging

Description

June 23, 2020

Packaging plays a significant role in the performance of your DC/DC buck converter. In this short video, we will discuss several recent packaging technology enhancements that could make your power supply smaller, quieter, or easier to design: 

  1. HotRod QFN, also known as flip-chip-on-lead
  2. Wettable flanks
  3. Integrated VIN capacitors
  4. Optimized device pinout

Additional information

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