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Introducing TI bulk acoustic wave (BAW) resonator technology

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Date: February 8, 2019

TI's breakthrough BAW resonator technology paves the way for stable, secure and high-performance communications infrastructure and connectivity.  Designers can leverage innovative chips with TI’s BAW technology to shrink BOM, improve network performance and increase immunity to vibration and shock in next-generation industrial and telecommunication applications.

What is TI bulk acoustic wave (BAW) technology?

BAW is a micro-resonator technology that enables the integration of high-precision and ultra-low jitter clocks directly into packages that contain other circuits. BAW technology is less bulky than external quartz crystals – delivering cleaner wired and wireless signals over networks. It enables higher quality communications and more efficiency to a range of areas, from wireless consumer electronics to high-end industrial systems.

What are the benefits of TI BAW technology?

TI’s BAW technology is supported by the world’s first crystal-less MCU as well as the first network synchronizer clock with a BAW resonator. With simplified designs integrated on a single chip, TI’s BAW technology allows you to reduce the overall design footprint and development costs. Additionally, there are more design options and flexibility in a wider range of applications and environments.

Learn more about TI BAW technology:

Watch: BAW for clocking

Read the company blog

Watch: BAW for wireless MCUs

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