Industrial TI Tech Days 2020

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3.6 Designing with emerging technologies: Ultrasonic sensing and capacitive touch

説明

2020年 11月 6日

Industrial TI Tech Days session

This two-part session will showcase how to design with unique, specialized technologies, ultrasonic sensing and capacitive touch, using MSP430™ MCUs. The first part of the session will take you through the process of modifying a parametric waveguide design (for 3D print). You will learn how to use the TI Ultrasonic Design Center Parameters to evaluate 3 different ultrasonic transducers with TI’s MSP430FR6043 Ultrasonic Sensing Solution for contactless level sensing applications. In part 2, we will walk through how to create a basic multi-sensor capacitive touch solution using MSP430’s automated tools to generate sensor configurations and software. We will then go into how to configure the board layout and software for a custom trackpad. 

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