Industrial TI Tech Days 2020

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2.5 How TI Smart Amp technology enables high quality audio with built-in advanced speaker protection

説明

2020年 11月 5日

Industrial TI Tech Days session

Audio system designers need to continuously optimize the overall performance of the audio subsystems in terms of loudness, voice clarity, reliability and power efficiency. However, at the same time the form factor of the end equipment’s keep shrinking; hence the mechanical design requires the use of smaller speakers, PCB and batteries which normally will reduce the performance of the audio subsystem. This design challenge creates a great opportunity for the broad adoption of the TI smart amp technology, which has been successful and optimized over the years for smart home and personal electronics applications.

This session will introduce the latest TI Smart Amp technology and device features such as speaker protection algorithm, integrated IV sense, audio processing, algorithm controlled look ahead class H boost, thermal fold back, brownout protection and integrated PDM mic interface.   

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