Enhancing power supply performance with the TPSM53604 power module


Maximizing 36V, 4A power density with enhanced thermal performance


2019年 12月 12日

Every power supply designer is trying to maximize efficiency and eliminate every last milliwatt that is lost as heat in DC/DC conversion. So what if I told you that TI has a power module that not only allows you to boost DC/DC conversion efficiency, but also do so with a smaller power supply footprint? 

The TPSM53604 is the first device in TI's power module portfolio to offer you this combination in Enhanced HotRod™ QFN package, with a solution size that is 30% smaller than competing BGA solutions while also providing a 300mW reduction in power loss. Watch the video to learn more.


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