Designing a low EMI power supply

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2.1 Package optimization – HotRod™ and Enhanced HotRod QFN™

説明

2021年 3月 3日
HotRod, or flip-chip on leadframe QFN packages, eliminate the need for bondwires. See how you can use our HotRod package technology in an appropriate layout to mitigate EMI issues, while additional HotRod enhancements like thermal pads can also reduce your solution size. 

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