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2.4 Reduce EMI and shrink solution size with Hot Rod packaging

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日付: 2018年 3月 7日

With a flipped-chip-on-lead construction, the Hot Rod QFN package utilized by the 36V, 3A LMR33630 and 60V, 1.5A LMR36015 requires no internal bond wires, eliminating a common source of parasitics that would otherwise impact EMI performance. Watch the video to see how Hot Rod and an intelligent pin-out work together to provide excellent EMI performance. But wait, there's more- the Hot Rod package used by LMR33630/LMR36015 measures a tiny 2mm x 3mm and requires minimal external components, allowing you to improve EMI performance and shrink solution size at the same time. 

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