Reduce EMI and shrink solution size with Hot Rod packaging
説明
2018年 3月 7日
With a flipped-chip-on-lead construction, the Hot Rod QFN package utilized by the 36V, 3A LMR33630 and 60V, 1.5A LMR36015 requires no internal bond wires, eliminating a common source of parasitics that would otherwise impact EMI performance. Watch the video to see how Hot Rod and an intelligent pin-out work together to provide excellent EMI performance. But wait, there's more- the Hot Rod package used by LMR33630/LMR36015 measures a tiny 2mm x 3mm and requires minimal external components, allowing you to improve EMI performance and shrink solution size at the same time.
追加情報
このコースは、次のシリーズに属します
Date: 6月20日2017年
Date: 11月14日2019年