This video demonstrates the various configurations of interfaces enabled by MSP capacitive touch MCUs and the MSP CapTIvate MCU Development Kit.

This video highlights the proximity sensing and 3D gesture capabilities enabled by MSP capacitive touch MCUs and the MSP CapTIvate MCU Development Kit.

Demos of the new SimpleLink wireless MCUs and MSP430 MCUs with CapTIvate touch technology.

Designing with emerging technologies: Ultrasonic sensing and capacitive touch

Overview of designing with the C2000 F2807x/F2837x device family.  

Segment LCDs might be “old school” but they are designed into almost every part of the electronics world today. In this session, discover the ULP devices that e

MSP430 microcontrollers for building automation systems

This module discusses the common mechanical implementation for case tamper detection and a new way to detect case openings using inductive switches

This module discusses magnetic tampering tests that were performed on the TIDA-00839 reference design using the DRV5033 to detect magnetic tampering in e-meters

This module covers how to the use hall sensors, such as the DRV5033, for the low-power detection of strong magnetic fields in three dimensions.

A walkthrough of using the SimpleLink SDK and TI-RTOS to sample an MSP432 high precision ADC.

Learn how to get started developing with MSP432 using TI's cloud tools

Learn how to get started with the Digital Power Buck Converter BoosterPack, part of TI's LaunchPad Development Ecosystem.

Learn about the TI Digital Power Buck Converter BoosterPack. This board showcases a buck converter power stage with a dynamic load that converts an external 9V

This presentation will introduce two totem-pole bridgeless PFC designs using C2000 MCU and TI high voltage GaN devices

Digitally Controlled High Efficiency and High Power Density PFC Circuits

This presentation will introduce two bridgeless PFC designs using C2000 MCU and TI high voltage GaN