Automotive TI Tech Days 2020

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2.3 Solving Common Buck Converter Design Challenges

説明

2020年 8月 21日
This training session will show how to meet lower ripple and higher voltage accuracy requirements for powering new signal chain and processor loads, while addressing the thermal and SOA challenges that new high-density power solutions provide.  We will examine different converters and present their capabilities compared to older solutions and show how smaller power process nodes allow better accuracy, lower noise, faster frequency and better minimum on-time with smaller external components.

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