Managing heat dissipation with DC/DC switching regulators

メール

2.3 Trade-offs between thermal performance and small solution size with DC/DC converters

説明

2018年 3月 8日
As output current levels increase and PCB area continues to shrink, the hunt for better power density shows no signs of coming to an end. But while heat dissipation is improving with today's small packages, there is still a trade-off to be taken into consideration. The 36V, 3A LMR33630 provides an excellent test case, as it comes in both an SOIC-8 package as well as a 2mm x 3mm Hot Rod QFN. In this training, we compare the thermal performance of each under the same operating conditions.

追加情報

arrow-topclosedeletedownloadmenusearchsortingArrowszoom-inzoom-out arrow-downarrow-uparrowCircle-leftarrowCircle-rightblockDiagramcalculatorcalendarchatBubble-doublechatBubble-personchatBubble-singlecheckmark-circlechevron-downchevron-leftchevron-rightchevron-upchipclipboardclose-circlecrossReferencedashdocument-genericdocument-pdfAcrobatdocument-webevaluationModuleglobehistoryClockinfo-circlelistlockmailmyTIonlineDataSheetpersonphonequestion-circlereferenceDesignshoppingCartstartoolsvideoswarningwiki