2.3 Trade-offs between thermal performance and small solution size with DC/DC converters
2018年 3月 8日
As output current levels continue to rise and the PCB area for power supplies continues to shrink, the hunt for better power density shows no signs of coming to an end. But while heat dissipation is absolutely improving with today's small packages, there is still a trade-off to be taken into consideration. The new 36V, 3A LMR33630 provides an excellent test case, as it features both an 8-pin SOIC package as well as a tiny 2mm x 3mm Hot Rod QFN. In this training, Frank compares the thermal performance of each device under the same operating conditions.