Unlock improved power module thermal performance with TPSM53604 and Enhanced HotRod™ QFN packaging
2019年 12月 12日
Traditionally, the downside of shrinking power supply solution size has been that thermal performance tends to be degraded. But with the TPSM53604 and Enhanced HotRod™ QFN packaging, this concern is a thing of the past. Watch the video to learn how you can shrink your power module size by 30% compared to a BGA solution, and do so with vastly improved thermal performance.