1.7 Power design with thermal reliability in mind
2020년 11월 5일
Industrial TI Tech Days sessionWhen it comes to improving the thermal reliability of your design, it is important to understand how the package technology of your chosen DC/DC regulator impacts thermal performance. Knowing the tradeoffs of common package technologies, such as HotRod™ and standard wirebond QFN, can help you avoid redesign later. Learn how to pick the correct DC/DC package for optimal thermal design and how to leverage the data sheet parameters before ever having to touch a soldering iron.