Reducing EMI through IC and package innovations
Reducing EMI starts with device selection. Learn about various silicon and packaging technologies that can help you mitigate EMI from the start.
Efficiently addressing EMI starts at the device selection stage. On-silicon technologies like spread spectrum or unique packaging approaches like HotRod™ QFN can help reduce EMI before we even begin the discussion of component layout and filtering.
Resources:
- White paper: Simplify low EMI design with power modules
- Technical article: Effects of IC package on EMI performance
- Technical article: How a DC/DC converter package and pinout design can enhance automotive EMI performance
