Reducing EMI through IC and package innovations
Efficiently addressing EMI starts at the device selection stage. On-silicon technologies like spread spectrum or unique packaging approaches like HotRod™ QFN can help reduce EMI before we even begin the discussion of component layout and filtering.
- White paper: Simplify low EMI design with power modules
- Technical article: Effects of IC package on EMI performance
- Technical article: How a DC/DC converter package and pinout design can enhance automotive EMI performance