Layout, power loss, and packaging to address thermal concerns with integrated FET DC/DC converters
This training series dives into how to get the best thermal performance with TI’s latest buck converters. Special focus given to the HotRod package.
Table of contents
Additional information
1. Layout, power loss and packaging to address thermal concerns with integrated FET DC/DC converters
What you’ll learn:
- How the current ratings for TI DC/DC converters are defined and what they mean in practice
- The tradeoffs of various board layout variables when designing with a HotRodTM package
- The difference in performance between HotRodTM and traditional QFN by evaluating the same part in both packages.
| # | Title | Duration | ||
|---|---|---|---|---|
| 1.1 |
Layout, power loss, and packaging, to address thermal concerns with integrated FET DC/DC converters - 1 - Introduction
This session dives into how to get the best thermal performance with TI’s latest buck converters. Special focus given to the HotRod package.
|
06:56 | This session dives into how to get the best thermal performance with TI’s latest buck converters. Special focus given to the HotRod package. | |
| 1.2 |
Layout, power loss, and packaging to address thermal concerns with integrated FET DC/DC converters - 2 - Current Rating
What sets the current rating for a DC/DC converter
|
12:13 | What sets the current rating for a DC/DC converter | |
| 1.3 |
Layout, power loss, and packaging to address thermal concerns with integrated FET DC/DC converters - 3 - Thermal Metrics
DC/DC Converter thermal package parameters and how they apply
|
10:30 | DC/DC Converter thermal package parameters and how they apply | |
| 1.4 |
Layout, power loss, and packaging to address thermal concerns with integrated FET DC/DC converters - 4 - Airflow and SOA
Effect of airflow on devices in powerstack clip QFN packages and how we measure it
|
05:19 | Effect of airflow on devices in powerstack clip QFN packages and how we measure it | |
| 1.5 |
Layout, power loss, and packaging to address thermal concerns with integrated FET DC/DC converters - 5 - Measuring ThetaJA and Thermal Coupling
Measuring Theta JA and Thermal Coupling
|
06:56 | Measuring Theta JA and Thermal Coupling | |
| 1.6 |
Layout, power loss, and packaging to address thermal concerns with integrated FET DC/DC converters - 6 - HotRod Layout
Effect of PCB Layout with HotRod Package
|
17:14 | Effect of PCB Layout with HotRod Package | |
| 1.7 |
Layout, power loss, and packaging to address thermal concerns with integrated FET DC/DC converters - 7 - HotRod vs QFN
HotRod vs traditional QFN Package
|
12:06 | HotRod vs traditional QFN Package |
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