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Package优化:HotRod™ 和增强型 HotRod QFN™
00:04:53
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05 FEB 2022
了解如何在适当的布局中使用我们的 HotRod 封装技术来缓解 EMI 问题,而热焊盘等额外的 HotRod 增强功能也可以减小您的解决方案尺寸。
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Time-Saving and Cost-Effective Innovations for EMI Reduction in Power Supplies