March 3, 2021
HotRod, or flip-chip on leadframe QFN packages, eliminate the need for bondwires. See how you can use our HotRod package technology in an appropriate layout to mitigate EMI issues, while additional HotRod enhancements like thermal pads can also reduce your solution size.
2Reducing EMI through IC and package innovations (7)
Reducing EMI starts with device selection. Learn about various silicon and packaging technologies that can help you mitigate EMI from the start.
3Reducing EMI through input filter design, PCB and BOM optimization (5)
If your device has switching elements, it's going to emit EMI. Learn how to minimize it through input filter design, PCB and BOM optimization.
4Application-specific EMI considerations (5)
Certain applications require unique EMI considerations. Let's take a look at a few examples in this section.