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TI-RSLK

TI-RSLK Module 18 – Serial communication

The purpose of this module is to understand the operation and use of first in first out (FIFO) queue to interface the robot to the PC using a serial channel. You will create two FIFO queues and design a command interpreter to assist in the robot challenge. You will develop an interrupting device driver using the universal asynchronous receiver/transmitter (UART). This serial port allows the microcontroller to communicate with devices such as other computers, input sensors, and output displays.
TI-RSLK

TI-RSLK Module 19 – Bluetooth low energy

The purpose of this module is to understand basic concepts of Bluetooth® low energy (BLE). You will interface the TI SimpleLink™ BLE CC2650 Module BoosterPack™ Plug-in module to the SimpleLink MSP432P401R LaunchPad™ development kit using universal asynchronous receiver/transmitter (UART) communication. You will create a BLE service with multiple characteristics and design a robot system that can be controlled by a smart device using BLE.

TAS5825M Innovation Features Overview

What are the audio amplifier requirements for wireless / AI speaker? How TAS5825M improve battery lifetime and audio quality?

This section provides the overview of TAS5825M innovation features.

TAS5825M Hybrid PWM Modulation to Improve Battery Efficiency

Compared with traditional PWM modulation, TAS5825M develops innovative Hybrid modulation, which dynamically maintains differential switching with several common duty options.

The benefits of Hybrid PWM modulation mainly includes:

  1. Higher efficiency for longer battery lifetime
  2. Good THD+N performance
  3. Ultra-low idle power dissipation and idle noise

TAS5825M Thermal Foldback, Inductor Free and Audio DSP Resource

This training section descripts some innovation features of TAS5825M, which includes:

  1. Real-time thermal foldback: maintain max safe output power for uninterrupted listening experience
  2. 122MHz DSP resource: 192kHz high definition audio processing or Smart Amp algorithm for better speaker protection
  3. Inductor less: state-of-the-art EMI reduction technology
using the fusion GUI to configure a sequencer

Getting Started

This section explains how to connect the EVMs and download, install, and launch the Fusion Digital Power Designer.
using the fusion GUI to configure a sequencer

Using the Fusion Digital Power Designer

The Fusion Digital Power Designer is packed with features. Explore below to learn how to use them all.
From Zero to Hero: Time-of-Flight Training (ToF) Series

Technology overview

Learn about the advantages and tradeoffs between optical and ToF technologies and how to select the right distance and range-sensing technology to meet your system needs.
From Zero to Hero: Time-of-Flight Training (ToF) Series

Tools training

Learn about the tools and resources TI provides to help you prototype easier and faster.

AM65x Sitara Processors Overview

This section provides an overview of the AM65x Sitara processors for industrial application development.

AM65x Sitara Processors Flash Subsystem (FSS)

These training modules provide an introduction to the Sitara AM6x processor Flash Subsystem (FSS), which is used to interface to Octal SPI (OSPI) and HyperBus devices. 
Introduction to TDA2x evaluation module

Introduction to TDA2 Evaluation Module

This section introduces the TDA2x Vision EVM Kit (TDA2EVM5777) available from TI for Jacinto TDA2 SoC. The video series provide a quick overview of the TI EVM and its capabilities for ADAS solutions along with providing information on the setup and getting started with development
Introduction to the TDA3x evaluation module

Introduction to TDA3 Evaluation Module

This section introduces the TDA3x evaluation module (TDA3XEVM) available from TI for Jacinto TDA3 SoC. The video series provide a quick overview of the TI EVM and its capabilities for ADAS solutions along with providing information on the setup and getting started with development.

Current sensor and metrology architecture options

This section compares two types of current sensors used in electricity meters: current transformers and shunts.  In addition, it discusses three different architectures for sensing the voltage and current samples used to calculate the metrology parameters.  These architectures include a SoC-based architecture, AFE-based architecture, and ADC-based architecture.

Introduction to TIDA-010037 reference design

This section provides an overview of the TIDA-010037 reference design, which uses the ADS131M04 delta sigma standalone ADC for sensing the voltage and current necessary to calculate metrology parameters.  The TIDA-010037 design targets Class 0.1 split-phase current transformer meters.

TIDA-010037 hardware design

This section provides an overview of the hardware used in the TIDA-010037 design, which includes information on the eFuse circuit used to create a current limited rail for connection to an external communication module.  In addition, this section discusses the circuits used to translate the Mains voltage and current to the voltage waveform sensed by the ADS131M04.

Designing software for split-phase electricity meters that use standalone ADCs

This section covers the initialization code and algorithms that can be used to calculate metrology parameters in a split-phase system using the sensed voltage and current samples

Calibration and metrology accuracy results

This section discusses the procedure used to calibrate the TIDA-010037 design and the results obtained with this design.

Summary

In this section, a summary of the entire “How to design high-accuracy CT-based split-phase electricity meters using standalone metrology ADCs” training module would be covered.  Links will be provided for the reference designs that were discussed during this training series.

Current sensor and metrology architecture options

This section compares two types of current sensors used in electricity meters: current transformers and shunts.  In addition, it discusses three different architectures for sensing the voltage and current samples used to calculate the metrology parameters.  These architectures include a SoC-based architecture, AFE-based architecture, and ADC-based architecture.
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