Some systems simply require more attention than others when it comes to EMI. In this section, we will examine some of those specific end applications and provide some helpful hints to reach EMI targets with each.
Before we dive into specific application-based examples of noise and EMI mitigation, let's start with the basics. What is EMI? How is this different from noise? What is ripple? How are they measured? What are some common approaches to limiting their effects? This section discusses these topics with a more conceptual approach to serve as a primer for the rest of the series.
Reducing power supply solution size has traditionally come at the expense of reduced efficiency and thermal performance. But with routable lead frame (RLF) packaging technology, this is no longer the case. See how the TPSM53604 36V, 4A power module leverages the power of RLF technology to buck the trend and set a new bar for power module size and performance.
For many engineers, layout for EMI mitigation is a black art. It may seem like the slightest adjustment could be the difference between passing or failing CISPR standards. Because of this, some power designers may shy away from using devices with switching elements as a guaranteed way to avoid the headache of reducing emissions. But this may be trading one problem for another, as switching devices generally have better efficiency and thermal performance.
Efficiently addressing EMI starts at the device selection stage. On-silicon technologies like spread spectrum or unique packaging approaches like HotRod™ QFN can help reduce EMI before we even begin the discussion of component layout and filtering.
Mitigating EMI is seen by engineers as a black art. Choose the wrong feature set - or mess with the feng shui of the PCB layout too much - and the system may not pass stringent CISPR standards.
This training series - along with all of the accompanying documentation - is an aggregation of reference materials showing how engineers an easier path to design an efficient power supply that meets EMI requirements.
This sections covers tips for selecting the appropriate capacitors for your switching power supply.
This sections covers tips for selecting the appropriate inductors for your switching power supply.
Learn about how to overcome high frequency challenges using TI's series capacitor buck converter.
This video presents a short overview of automotive frond-end and the transients tackled by the frond-end power conversion stage connected to an automotive battery rail.
This section presents a high level overview of automotive board net and the describes the conditions that the the tests simulate. These include:
- Reverse polarity
- Jump start
- Load sump
- Starting profile
- Superimposed ac
This section presents an approach to architecting the dc-dc conversion stage to handle the transients on automotive battery rail. Following topologies are covered:
- Always-on boost + buck
- On-demand boost + buck
- Buck + post boost
Pro/cons of the different approaches are also discussed.