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330 Results
TPSM53604 thermals

Unlock improved power module thermal performance with routable lead frame technology

Date:
December 12, 2019

Duration:
02:29
Improve power module thermal performance with a smaller footprint using routable lead frame packaging technology
TPSM53604 efficiency

Increasing power module efficiency with routable lead frame packaging technology

Date:
December 12, 2019

Duration:
02:57
Learn how to increase power module efficiency with routable lead frame packaging technology

Boost Converters and Controllers

Date:
December 5, 2019

Duration:
23:31
Boost Converter & Controller Solutions new products/reference design update

Application-Specific EMI Considerations

Some systems simply require more attention than others when it comes to EMI. In this section, we will examine some of those specific end applications and provide some helpful hints to reach EMI targets with each.

Resources:

EMI: The Fundamentals

Before we dive into specific application-based examples of noise and EMI mitigation, let's start with the basics. What is EMI? How is this different from noise? What is ripple? How are they measured? What are some common approaches to limiting their effects? This section discusses these topics with a more conceptual approach to serve as a primer for the rest of the series. 

Resources:

routable lead frame thermal performance

Leveraging routable lead frame technology to enhance power supply performance

Reducing power supply solution size has traditionally come at the expense of reduced efficiency and thermal performance. But with routable lead frame (RLF) packaging technology, this is no longer the case. See how the TPSM53604 36V, 4A power module leverages the power of RLF technology to buck the trend and set a new bar for power module size and performance.

Reducing EMI via considerations external to the IC

For many engineers, layout for EMI mitigation is a black art. It may seem like the slightest adjustment could be the difference between passing or failing CISPR standards. Because of this, some power designers may shy away from using devices with switching elements as a guaranteed way to avoid the headache of reducing emissions. But this may be trading one problem for another, as switching devices generally have better efficiency and thermal performance.

Modules EMI

Reducing EMI through device selection

Efficiently addressing EMI starts at the device selection stage. On-silicon technologies like spread spectrum or unique packaging approaches like HotRod™ QFN can help reduce EMI before we even begin the discussion of component layout and filtering. 

Resources:

Low EMI

Designing a Low EMI Power Supply

Mitigating EMI is seen by engineers as a black art. Choose the wrong feature set - or mess with the feng shui of the PCB layout too much - and the system may not pass stringent CISPR standards. 

This training series - along with all of the accompanying documentation - is an aggregation of reference materials showing how engineers an easier path to design an efficient power supply that meets EMI requirements.

Designing a modern power supply for RF sampling converters

When: October 28, 2019
Learn how to design a simpler signal chain that uses a PCB with a much smaller footprint.
SIMPLE SWITCHER LMR33640

Case Study: Speeding up time to market with scalable DC-DC converters

Date:
October 22, 2019

Duration:
04:42
Watch ease of use in action with scalable SIMPLE SWITCHER® converters and WEBENCH®
Enhanced thermals and EMI with 2-layer

Managing thermals with a 2-layer board

Date:
October 17, 2019

Duration:
03:41
A brief discussion of buck converter thermal performance optimization using a two-layer board

Reduce design risk for Low Earth Orbit satellites and other New Space applications

When: October 8, 2019 2:00 pm
What is NewSpace? What does it mean for satellite design? Explore products that meet quality & reliability requirements for short space flights and LEO designs.

Addressing Common DC/DC Switching Regulator Design Challenges

Date:
October 4, 2019

Duration:
27:54
Discover the right family of DC/DC switching regulator to address your specific power supply design challenge

Capacitor selection

This sections covers tips for selecting the appropriate capacitors for your switching power supply.

Inductor selection

This sections covers tips for selecting the appropriate inductors for your switching power supply.

High Frequency Challenges

Learn about how to overcome high frequency challenges using TI's series capacitor buck converter.

Automotive front end power stage

Automotive transients introduction

This video presents a short overview of automotive frond-end and the transients tackled by the frond-end power conversion stage connected to an automotive battery rail.

Automotive front end power stage

Automotive transients explained

This section presents a high level overview of automotive board net and the describes the conditions that the the tests simulate. These include:

  • Reverse polarity
  • Jump start
  • Load sump
  • Starting profile
  • Superimposed ac
Automotive front end power stage

Architecting the dc-dc stage for automotive transients

This section presents an approach to architecting the dc-dc conversion stage to handle the transients on automotive battery rail. Following topologies are covered:

  • Buck-boost
  • Always-on boost + buck
  • On-demand boost + buck
  • Buck + post boost

Pro/cons of the different approaches are also discussed.

330 Results
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