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581 Results
Enhanced thermals and EMI with 2-layer

Achieve buck converter thermal and EMI performance targets with a 2-layer board

Date:
August 23, 2019

Duration:
04:20
Leverage good PCB layout to achieve excellent thermal and EMI performance with a 2-layer board
USB Type-C and USB PD evaluation module for high power source and sink

How to achieve high power charging and low RDS(on) with TI's Power Duo mode

Date:
August 9, 2019

Duration:
03:36
See how you can use TI's newest high-power USB Type-C PD controller EVM and source and sink EVMs to achieve high power source and sink while reducing the RDSon

Intelligent Robotics with TI mmWave AoP sensors

Date:
July 31, 2019

Duration:
01:59
Robotics demo video using TI mmWave antenna-on-package sensors

TI-RSLK MAX Construction Guide

The video series shows how to construct the TI Robotics Systems Learning kit or TI-RSLK MAX. You will learn how to assemble and disassemble the robot, make any updates to your LaunchPad. You can even attach OLED and LED display to your robot so you can monitor where your robot is moving!

TI Robotics System Learning Kit MAX (TI-RSLK MAX)

The TI-RSLK MAX is a low-cost robotics kit and classroom curriculum which provides students with a deeper understanding of how electronic system designs work.  Developed with university faculty, Jon Valvano of UT Austin, the TI-RSLK MAX is designed to supplement university curriculum.

SPI level translation AXC4T774 EVM

SPI JTAG Level translation using AXC4T774EVM

Date:
July 5, 2019

Duration:
04:29
Low voltage level translation using SN74AXC4T774EVM

Voltage Translation for the Serial Peripheral Interface(SPI)

Date:
July 3, 2019

Duration:
02:58
Serial Peripheral Interface and TI's voltage level translation solutions

MSP430 MCUs Smart Analog Combo training

Did you know that you can use a microcontroller to recognize many analog signal chain configurations? The MSP430 MCU portfolio has two device families, the MSP430FR2355 and MSP4302311, that have many configurable signal chain elements. Using this feature can help you save BOM costs and simplify board complexity.

Why design with MSP430FR2355?

The MSP430FR2355 is designed to match your project needs, by adding more analog features, extending the temperature range and extending a broad MSP430 MCU portfolio.  This 4-part series showcases the MSP430FR2355 device and how it can help you solve your design challenges.
Get started today with TIDA-01589

Simplify Your Smart Home Audio Project with the Two-Way Audio Reference Design

Date:
June 4, 2019

Duration:
02:03
Learn about the two-way audio reference design and how it uses TI Smart Amp to enable big sound from small speakers and accelerates your project timeline.

Intelligent Automated Doors with TI mmWave Sensors

Date:
May 9, 2019

Duration:
01:38
Bring intelligence to your automated door and gate design with TI mmWave sensors.
TI Precision Labs – Magnetic Sensors: Using Hall Effect Position Sensors for Rotary Encoding Applications

TI Precision Labs - Magnetic Sensors: Using Hall Effect Position Sensors for Rotary Encoding Applications

Date:
May 5, 2019

Duration:
05:51
This video explains how a Hall Effect sensor can be used for rotary encoding applications.
TI Precision Labs – Magnetic Sensors: Bandwidth vs. Power Tradeoffs in Hall Effect Position Sensors

TI Precision Labs - Magnetic Sensors: Bandwidth vs. Power Tradeoffs in Hall Effect Position Sensors

Date:
May 5, 2019

Duration:
03:13
This video discusses the tradeoffs between bandwidth and power in Hall Effect sensors.
BQ76920, BQ76930, BQ76940 Creating Your Schematic

How to create schematic for BQ76920, BQ76930 and BQ76940

Date:
May 2, 2019

Duration:
09:46
This video will walk you through the basics of creating a schematic using the BQ769x0 family.
How to solve design challenges on interfacing Ethernet PHY with application processor or microcontrollers

How to solve design challenges on interfacing Ethernet PHY with application processor or microcontrollers

Date:
April 30, 2019

Duration:
22:01
This video shows how to solve design challenges on interfacing Ethernet PHY with application processor or microcontrollers.

Have your cake and eat it too: Analog solutions within a digital microcontroller

Date:
April 24, 2019

Duration:
32:34
There are many configurable signal chain elements integrated on the MSP430FR2355. Find out how it can help you!

LiDAR Pulsed Time-of-Flight Reference Design Overview (TIDA-01187)

Date:
April 17, 2019

Duration:
03:02
This video describes how Light Detection and Ranging (LiDAR) systems use a laser to measure the distance to an object using a time-of-flight method.

Low quiescent current in action: reference designs

Date:
April 4, 2019

Duration:
04:27
Overview of reference designs that meet low standby power requirements of field transmitters and battery-powered applications

High-Efficiency Motor Drives with GaN

Date:
April 2, 2019

Duration:
08:14
This video reviews the three-phase, 1.25-kW, 200-VAC small form factor GaN inverter reference design for integrated drives (TIDA-00915).

Designing 6.6kW Bidirectional HEV/EV On-Board-Charger with SiC and Embedded Technologies

In this series of presentations, we go through the HEV/EV market status and history, OBC specifications, technology trend, topology selections and design considerations of an OBC system. Complete test results of a 6.6kW OBC reference design (Including AC-DC rectifier and isolated DC-DC converter) will be shown in the end of this paper to demonstrate the performance of our TIDesigns as well as TI SiC and embedded Technologies.
581 Results
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