Some systems simply require more attention than others when it comes to EMI. In this section, we will examine some of those specific end applications and provide some helpful hints to reach EMI targets with each.

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Before we dive into specific application-based examples of noise and EMI mitigation, let's start with the basics. What is EMI? How is this different from noise? What is ripple? How are they measured? What are some common approaches to limiting their effects? This section discusses these topics with a more conceptual approach to serve as a primer for the rest of the series. 

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For many engineers, layout for EMI mitigation is a black art. It may seem like the slightest adjustment could be the difference between passing or failing CISPR standards. Because of this, some power designers may shy away from using devices with switching elements as a guaranteed way to avoid the headache of reducing emissions. But this may be trading one problem for another, as switching devices generally have better efficiency and thermal performance.

Efficiently addressing EMI starts at the device selection stage. On-silicon technologies like spread spectrum or unique packaging approaches like HotRod™ QFN can help reduce EMI before we even begin the discussion of component layout and filtering. 

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Mitigating EMI is seen by engineers as a black art. Choose the wrong feature set - or mess with the feng shui of the PCB layout too much - and the system may not pass stringent CISPR standards. 

This training series - along with all of the accompanying documentation - is an aggregation of reference materials showing how engineers an easier path to design an efficient power supply that meets EMI requirements.