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70 Results
Kick to open

Kick to Open Reference Designs

Date:
September 20, 2017

Duration:
34:27
Kick to Open Reference Designs using Capacitive and Ultrasonic Sensing

Introduction to Rotary Position Sensors

Date:
May 5, 2017

Duration:
11:59
Learn about the different types of rotary position sensors used in automotive and industrial applications such as HEV/EV, electric power steering, and factory robotics.

Multi-switch Detection Interface (MSDI) for automotive and industrial applications

In this training, the audience will learn about the unique challenges faced by automotive system designers today to implement circuitry to detect external switches in a vehicle. The audience will understand the unique features offered by the MSDI and how they help solve these challenges. The audience will also learn about some of the more advanced features offered by the MSDI and how a system designer can take advantage of them in their design. The application of using the MSDI in an industrial system will also be briefly discussed.

How MSDI helps solve system-level challenges in BCM design

Date:
April 21, 2017

Duration:
09:05
How MSDI helps solve system-level challenges in BCM design

Challenges in today’s Body Control Module (BCM) design

Date:
April 21, 2017

Duration:
11:44
​Challenges in today’s Body Control Module (BCM) design

Learn Different Solutions to Design a Field Transmitter Ultrasonic AFE

Date:
April 21, 2017

Duration:
10:40
This system training will guide you through different innovative solutions to design a field transmitter ultrasonic AFE based on the PGA460, MSP430 and TDC1000

PGA460 Ultrasonic Sensing Module Overview for Air-Coupled Applications

Date:
April 16, 2017

Duration:
22:12
This video provides an overview of ultrasonic time-of-flight sensing technology fundamentals and ultrasound principles.

Anti-tamper Techniques to Thwart Attacks on Smart Meters— Summary

Date:
April 12, 2017

Duration:
01:00
In this short module, a summary of the entire “Anti-tamper Techniques to Thwart Attacks on Smart Meters” training series will be covered.

Anti-tamper Techniques to Thwart Attacks on Smart Meters—Detecting case tamper attacks using inductive switches: TIDA-01377 Case Tamper Detection using Inductive Sensing Reference Design Demo

Date:
April 12, 2017

Duration:
07:35
Watch the TIDA-01377 in action as it detects when someone opens the terminal block case of an electricity meter!  

Anti-tamper Techniques to Thwart Attacks on Smart Meters—Detecting case tamper attacks using inductive switches: Designing PCB Inductors and Selecting a Target Metal

Date:
April 12, 2017

Duration:
03:12
This module covers how to design and optimize PCB coils used for the inductive-based case tamper detection implementation. 

Anti-tamper Techniques to Thwart Attacks on Smart Meters—Detecting case tamper attacks using inductive switches: Case Tamper Detection Implementations

Date:
April 12, 2017

Duration:
07:10
This module discusses the common mechanical implementation for case tamper detection and a new way to detect case openings using inductive switches
Sensor signal conditioners for Industrial applications: from concept to production

Sensor signal conditioners for industrial applications: From concept to production

Date:
March 24, 2017

Duration:
09:55
Sensor signal conditioners are commonly used in sensing systems to accept information from the sense element and turn it into meaningful data for further analysis. Sensor signal conditioners play a key role in removing sensing non-idealities and process the data to attain precise measurements.The Texas Instruments PGA devices are sensor signal conditioners that can directly connect to the sensing element. These highly integrated system-on-chip ICs measure and apply gain to the signal by using an internal low-noise instrumentation amplifier (IA) and pass it to an analog-to-digital converter (ADC). The ADC data is then processed by an internal digital signal processing engine that compensates for the sensor non-idealities in order to output data that can be extracted by a variety of output interfaces that can be analog or digital.
PGA460 evaluation module (EVM) setup and install

PGA460 ultrasonic sensing: How to set up and install the EVM

Date:
March 3, 2017

Duration:
07:29
Introduction to BOOSTXL-PGA460 hardware and software and how to quickly set up and start capturing ultrasonic measurements.
PGA460 ultrasonic sensing: EVM hardware, transducer, and driver selection

PGA460 ultrasonic sensing: EVM hardware, transducer, and driver selection

Date:
March 3, 2017

Duration:
09:19
This video shows how to assemble the modules of the BOOSTXL-PGA460.
PGA460 ultrasonic sensing: EVM GUI introduction

PGA460 ultrasonic sensing: EVM GUI introduction

Date:
March 3, 2017

Duration:
05:22
Part 3 of the PGA460 Ultrasonic Sensing EVM Training Series introduces the PGA460-Q1 GUI used to configure, evaluate, and monitor performance the EVM.
PGA460 ultrasonic sensing: EVM GUI device configuration

PGA460 ultrasonic sensing: EVM GUI device configuration

Date:
March 3, 2017

Duration:
08:41
This video shows how to configure the PGA460 using the GUI’s block diagram, general, time varying gain, and threshold pages.
PGA460 ultrasonic sensing: EVM GUI data monitor

PGA460 ultrasonic sensing: EVM GUI data monitor

Date:
March 3, 2017

Duration:
07:40
This video shows how to interpret, read, and improve the echo data dump monitor and ultrasonic measurement results.
PGA460 ultrasonic sensing: EVM GUI system diagnostics

PGA460 ultrasonic sensing: EVM GUI system diagnostics

Date:
March 3, 2017

Duration:
03:59
This video shows how to analyze the ultrasonic module system diagnostics to ensure proper operation of the PGA460, driver, and transducer.

Ultrasonic Sensing with the PGA460-Q1

TI's PGA460-Q1 is the industry’s most flexible ultrasonic sensor. It supports wide distance detection range at low power, enabling automotive park assist and industrial applications. 

Embedded processor selection and integration for 3D time of flight sensing

Date:
February 18, 2017

Duration:
09:39
This video addresses selection and integration of embedded processors with operating system and software libraries for 3D time-of-flight solutions.
70 Results
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