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586 Results

TI-RSLK MAX Module 19 – Bluetooth low energy

The purpose of this module is to understand basic concepts of Bluetooth® low energy (BLE). You will interface the TI SimpleLink™ BLE CC2650 Module BoosterPack™ Plug-in module to the SimpleLink MSP432P401R LaunchPad™ development kit using universal asynchronous receiver/transmitter (UART) communication. You will create a BLE service with multiple characteristics and design a robot system that can be controlled by a smart device using BLE.

TI-RSLK MAX Module 20 – Wi-Fi

In this module, you will learn how to develop a set of Wi-Fi communication functions and learn how to interact with web services. By using the CC3100 to communicate with the MSP432, you will interface a Wi-Fi radio module to the microcontroller.

Rapid prototyping function based on I2C/SMBus

Date:
September 27, 2019

Duration:
10:05
This module provides step-by-step prototyping functionality (with demonstrations) based on the i2C/SMBus interface to a BQ battery charger device.

Rapid prototyping function based on reading A/D

Date:
September 25, 2019

Duration:
03:06
This module provides step-by-step prototyping functionality (with demonstrations) based on reading the Analog-to-Digital Converter (ADC)

Rapid prototyping function based on general purpose output

Date:
September 25, 2019

Duration:
02:52
This module provides step-by-step prototyping functionality (with demonstrations) based on basic general purpose (GP) output.

Introduction to rapid prototyping: Getting started with TI solutions

Date:
September 24, 2019

Duration:
02:18
This training shows you how to get started prototyping on TI solutions with minimal or no programming.
DLP Labs, DLP training, DLP Technology, headlight, headlamp, high resolution headlight, high resolution headlamp, adaptive driving beam,

DLP Technology advantages in high resolution headlights

Date:
September 5, 2019

Duration:
04:28
This video will outline key advantages for selecting DLP technology for high resolution headlights.
Enhanced thermals and EMI with 2-layer

Achieve buck converter thermal and EMI performance targets with a 2-layer board

Date:
August 23, 2019

Duration:
04:20
Leverage good PCB layout to achieve excellent thermal and EMI performance with a 2-layer board
USB Type-C and USB PD evaluation module for high power source and sink

How to achieve high power charging and low RDS(on) with TI's Power Duo mode

Date:
August 9, 2019

Duration:
03:36
See how you can use TI's newest high-power USB Type-C PD controller EVM and source and sink EVMs to achieve high power source and sink while reducing the RDSon

Intelligent Robotics with TI mmWave AoP sensors

Date:
July 31, 2019

Duration:
01:59
Robotics demo video using TI mmWave antenna-on-package sensors

TI-RSLK MAX Construction Guide

The video series shows how to construct the TI Robotics Systems Learning kit or TI-RSLK MAX. You will learn how to assemble and disassemble the robot, make any updates to your LaunchPad. You can even attach OLED and LED display to your robot so you can monitor where your robot is moving!

TI Robotics System Learning Kit MAX (TI-RSLK MAX)

The TI-RSLK MAX is a low-cost robotics kit and classroom curriculum which provides students with a deeper understanding of how electronic system designs work.  Developed with university faculty, Jon Valvano of UT Austin, the TI-RSLK MAX is designed to supplement university curriculum.

SPI level translation AXC4T774 EVM

SPI JTAG Level translation using AXC4T774EVM

Date:
July 5, 2019

Duration:
04:29
Low voltage level translation using SN74AXC4T774EVM

Voltage Translation for the Serial Peripheral Interface(SPI)

Date:
July 3, 2019

Duration:
02:58
Serial Peripheral Interface and TI's voltage level translation solutions

MSP430 MCUs Smart Analog Combo training

Did you know that you can use a microcontroller to recognize many analog signal chain configurations? The MSP430 MCU portfolio has two device families, the MSP430FR2355 and MSP4302311, that have many configurable signal chain elements. Using this feature can help you save BOM costs and simplify board complexity.

Why design with MSP430FR2355?

The MSP430FR2355 is designed to match your project needs, by adding more analog features, extending the temperature range and extending a broad MSP430 MCU portfolio.  This 4-part series showcases the MSP430FR2355 device and how it can help you solve your design challenges.
Get started today with TIDA-01589

Simplify Your Smart Home Audio Project with the Two-Way Audio Reference Design

Date:
June 4, 2019

Duration:
02:03
Learn about the two-way audio reference design and how it uses TI Smart Amp to enable big sound from small speakers and accelerates your project timeline.

Intelligent Automated Doors with TI mmWave Sensors

Date:
May 9, 2019

Duration:
01:38
Bring intelligence to your automated door and gate design with TI mmWave sensors.
TI Precision Labs – Magnetic Sensors: Using Hall Effect Position Sensors for Rotary Encoding Applications

TI Precision Labs - Magnetic Sensors: Using Hall Effect Position Sensors for Rotary Encoding Applications

Date:
May 5, 2019

Duration:
05:51
This video explains how a Hall Effect sensor can be used for rotary encoding applications.
TI Precision Labs – Magnetic Sensors: Bandwidth vs. Power Tradeoffs in Hall Effect Position Sensors

TI Precision Labs - Magnetic Sensors: Bandwidth vs. Power Tradeoffs in Hall Effect Position Sensors

Date:
May 5, 2019

Duration:
03:13
This video discusses the tradeoffs between bandwidth and power in Hall Effect sensors.
586 Results
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