This training series captures technical sessions from recent High Volt Interactive conferences. Watch and learn from each training video as it discusses various high-voltage topics. From the fundamentals of Power Factor Correction (PFC) to designing multi-kW power supply systems, pick your favorite topic and start learning today.
In today’s computing environment, CPUs, FPGAs, ASICs and even peripherals are growing increasingly complex and, consequently, so do their power delivery requirements. To handle the higher demands, multiphase regulators are becoming increasingly common on motherboards in many areas of computing--from laptops and tablets to servers and Ethernet switches. Designing with these regulators is more challenging than using conventional switchers and linear regulators, but the benefits of multiphase outweigh the complexity for high-performance power applications.
The below introductory section features a video briefly discussing what exactly multi-phase buck regulators are, what applications they're suited for, and some of the challenges associated with implementing them. Additionally, the listed resources dive a little deeper into the topics covered in the video, providing further instruction in the beginning of your multiphase journey.
In designing with multiphase, Carmen works through a six-phase design for powering the core voltage of a networking ASIC, Marketing Manager George Lakkas explains why multiphase converters are ideal for high currents, and TI engineers blog about common concerns and use contexts.
In testing in the lab, Carmen takes a six phase buck regulator through basic validation testing in the lab with plenty of tips and waveforms shared. Let Carmen show you how to test transient response, input and output ripple, phase stability, and thermal performance. Additionally, TI engineers blog about various lab tricks related to multiphase devices.
PCB layout tips to manage heat dissipation with your switching regulator
Another way to manage thermals is through IC packaging. Smaller and smaller packages continue to be introduced as output currents trend upward. Learn more about the packaging technologies that aid heat dissipation under these challenging conditions and enable high power density.