The need for improved power density is clear, but what limits designers from increasing power density today? Watch this five-part training series where we outline how to achieve higher power density by examining four critical aspects of high-power-density solutions, as well as relevant TI technologies and products supporting these specific requirements.
Topics in this training series:
Comité International Spécial des Perturbations Radioélectriques (CISPR) 25 is the typical starting point for evaluating conducted and radiated emissions in automotive systems. This topic addresses the unique challenges of designing power converters to pass CISPR 25 requirements, including background information on the CISPR 25 standard and test setups. We explain common noise sources in power converters and various techniques to reduce conducted and radiated emissions, including input filter design, frequency selection, mode selection, snubber design, shielding and layout.
Some systems simply require more attention than others when it comes to EMI. In this section, we will examine some of those specific end applications and provide some helpful hints to reach EMI targets with each.
Before we dive into specific application-based examples of noise and EMI mitigation, let's start with the basics. What is EMI? How is this different from noise? What is ripple? How are they measured? What are some common approaches to limiting their effects? This section discusses these topics with a more conceptual approach to serve as a primer for the rest of the series.
Reducing power supply solution size has traditionally come at the expense of reduced efficiency and thermal performance. But with TPSM53604 and its Enhanced HotRod™ QFN packaging, this is no longer the case. See how you can leverage the TPSM53604 in your next design to buck the trend and set a new bar for power module size and performance.
For many engineers, layout for EMI mitigation is a black art. It may seem like the slightest adjustment could be the difference between passing or failing CISPR standards. Because of this, some power designers may shy away from using devices with switching elements as a guaranteed way to avoid the headache of reducing emissions. But this may be trading one problem for another, as switching devices generally have better efficiency and thermal performance.
Efficiently addressing EMI starts at the device selection stage. On-silicon technologies like spread spectrum or unique packaging approaches like HotRod™ QFN can help reduce EMI before we even begin the discussion of component layout and filtering.
Mitigating EMI is seen by engineers as a black art. Choose the wrong feature set - or mess with the feng shui of the PCB layout too much - and the system may not pass stringent CISPR standards.
This training series - along with all of the accompanying documentation - is an aggregation of reference materials showing engineers an easier path to design an efficient power supply that meets EMI requirements.
Designing to the tight voltage tolerances of today’s modern central processing units and field programmable gate arrays (FPGAs) is becoming more difficult as their current draw increases and becomes more dynamic. Getting the correct output capacitance mix to ensure first-time power-delivery success is no small feat with >100-A steps and slew rates in excess of 100 A/µs. Standard point-of-load design techniques no longer hold true; we need new methods to choose the output capacitance.
This sections covers tips for selecting the appropriate capacitors for your switching power supply.
This sections covers tips for selecting the appropriate inductors for your switching power supply.
This training series will teach you the following:
- How to use WEBENCH Power Architect
- What are the FPGA Power Requirements? Learn ways to power FPGAs using Simple Switcher(R) Power Modules
In this training series, you will learn how the PMBus communication interface powers ASIC, FPGA, and DDR Rail power designs. Browse through the following sessions:
- Part 1: ASIC
- Part 2: Adaptive Voltage Scaling (AVS)
- Part 3: PMBus in Manufacturing
- Part 4: Telemetry
Learn about how to overcome high frequency challenges using TI's series capacitor buck converter.
This video presents a short overview of automotive frond-end and the transients tackled by the frond-end power conversion stage connected to an automotive battery rail.
This section presents a high level overview of automotive board net and the describes the conditions that the the tests simulate. These include:
- Reverse polarity
- Jump start
- Load sump
- Starting profile
- Superimposed ac
This section presents an approach to architecting the dc-dc conversion stage to handle the transients on automotive battery rail. Following topologies are covered:
- Always-on boost + buck
- On-demand boost + buck
- Buck + post boost
Pro/cons of the different approaches are also discussed.
This section presents the different methods of protecting the electronic loads connected to the automotive battery rail in the event of accidental reverse battery connection. The methods covered include:
- Schottky diode
- PFET + discretes
- Smart diode + NFET