The topics will cover system design issue and solution for Building Automation, Power Delivery and Test & Measurement. TI experts introduce the latest technology and innovation system reference design. Discover ways to enhance the time-to-market and create safer and efficient industrial systems.
Learn about TI 3D depth sensing technology and implementation for industrial, automotive and consumer applications including gesture control, 3D scanning, robotic navigation, augmented reality and people counting. For additional information about 3D time-of-flight technology and design resources, please visit ti.com/3dtof.
This module discusses some of the advanced features offered by the MSDI, and how a system designer can take advantage of these features to improve their system performance.
Learn the different power stage architectures and topologies for low voltage brushed DC and stepper motor drives and understand typical system design challenges and differentiated solutions from Texas Instruments.
Learn the different power stage architectures and topologies for low voltage brushless DC motor drives and understand typical design challenges and differentiated solutions with integrated motor drivers.
This module discusses discrete implementation typically seen inside automotive body control module to monitor external switches. Common implementation methodology is reviewed in this section, and some of the challenges using discrete implementation is discussed in detail.
More and more end equipment start to use proximity sensors to detecting the presence of nearby objects without physical contact by using electromagnetic fields, light or sound, e.g. major appliances, cell phones, robot and so on. There are many types, each suited to specific applications and environments. The object being sensed is often referred to as the proximity sensor's target. Different proximity sensor targets demand different sensors. By analyzing the basic principle of different types of sensor, comparison result with advantages and disadvantages can be achieved.
This module concluds this traning session with highlights of the MSDI value propositions, as well as collaterals available to obtain more information about this MSDI device from Texas Instruments.
For anti-tampering, it is common to try to detect the presence of a strong magnet. In this section, we will cover the use of hall sensors for low-power detection of strong magnetic fields in three dimensions. Details on our magnetic tamper detection reference design, TIDA-00839, will be provided as well as some of the design considerations that were kept in mind when creating this reference design.
Engineer It is an educational, “how-to” video series where TI experts provide fundamental knowledge and solutions to overcome design challenges. Here, you can learn how to spin your motor in minutes, avoid amplifier input/output swing limitations, test and isolate power supplies and more from industry experts.
Building automation system is a communication network infrastructure that manages the building service. This training will introduce the environmental sensor black diagram, key reference design and the solution for IC temperature sensor, power saving analog temperature sensor, digital temperature sensor … etc.
In this section, we will cover how to harden a meter against these magnetic tamper attacks by using shunts for current sensors. For poly-phase implementations, I will go over how to use isolated delta sigma modulators to add the necessary isolation to use shunt current sensors and create magnetically immune poly-phase energy measurement systems. The TIDA-00601 and TIDA-01094 reference designs, which show how to implement a poly-phase isolated shunt measurement system, will be discussed as well as the associated AMC1304 high-side power supplies used in these designs.