March 8, 2018
As output current levels continue to rise and the PCB area for power supplies continues to shrink, the hunt for better power density shows no signs of coming to an end. But while heat dissipation is absolutely improving with today's small packages, there is still a trade-off to be taken into consideration. The new 36V, 3A LMR33630 provides an excellent test case, as it features both an 8-pin SOIC package as well as a tiny 2mm x 3mm Hot Rod QFN. In this training, Frank compares the thermal performance of each device under the same operating conditions.
1Optimizing PCB layout (2)
PCB layout tips to manage heat dissipation with your switching regulator.
Learn about the packaging technologies that aid heat dissipation and enable high power density.
3Increasing efficiency (1)
Managing heat in your power supply by choosing the right IC with the best efficiency.