Leveraging routable lead frame technology to enhance power supply performance

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Unlock improved power module thermal performance with routable lead frame technology

Description

December 12, 2019
Traditionally, the downside of shrinking power supply solution size has been that thermal performance tends to be degraded. But with the TPSM53604 and routable lead frame (RLF) packaging technology, this concern is a thing of the past. Watch the video to learn how you can shrink your power module size by 30% compared to a BGA solution, and do so with vastly improved thermal performance.  

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