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How power density, GaN and EMI innovations are pushing power management further

描述

2021年 10月 4日
New process, packaging and circuit-design technologies enable power-supply designers to develop next-generation integrated circuits (ICs) and systems — despite the wide-ranging challenges they must overcome in the design cycle. The best power devices for any application deliver smaller size, lower system costs, higher efficiency and greater reliability. Join Pradeep Shenoy, general manager of Automotive Power Design Services, to learn how innovations in three macro-level, power-management trends — power density, GaN and EMI — are helping engineers do just that.

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