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Layout, power loss and packaging to address thermal concerns with integrated FET DC/DC converters

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Improving thermals with integrated FET DC/DC converters. 7: HotRod™package vs QFN

2018年 5月 24日

This video discusses how the performance of a HotRod package compares to a QFN package. This comparison is done by measuring the performance of the TPS54824 in both a HotRod and a QFN package.

其他資訊

Learn more about the TPS54824.

TI 為一全球半導體設計與製造公司。因具有 100,000 個以上類比 IC 和嵌入式處理器而獨樹一幟，同時兼具軟體、工具及業界最大的銷售團隊/技術支援團隊。

Improving thermals with integrated FET DC/DC converters. 7: HotRod™package vs QFN

描述

其他資訊

1Improving thermals with integrated FET DC/DC converters. 1: Introduction

2Improving thermals with integrated FET DC/DC converters. 2: Current Rating

3Improving thermals with integrated FET DC/DC converters. 3: Thermal metrics

4Improving thermals with integrated FET DC/DC converters. 4: Airflow and SOA

5Improving thermals with integrated FET DC/DC converters. 5: ThetaJA and thermal coupling

6Improving thermals with integrated FET DC/DC converters. 6: HotRod™ package

7Improving thermals with integrated FET DC/DC converters. 7: HotRod™package vs QFN

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