Another way to manage thermals is through IC packaging. Smaller and smaller packages continue to be introduced as output currents trend upward. Learn more about the packaging technologies that aid heat dissipation under these challenging conditions and enable high power density.
- Technical article: Decoding power module derating curves
- White paper: Benefits and trade-offs of various power module package options
- Technical article: Make automatic optical inspection easy thanks to packages with wettable flanks
- White paper: 3D packaging advancements drive performance, power and density in power devices