Industrial TI Tech Days 2020

電子郵件

1.7 Power design with thermal reliability in mind

描述

2020年 11月 5日

Industrial TI Tech Days session

When it comes to improving the thermal reliability of your design, it is important to understand how the package technology of your chosen DC/DC regulator impacts thermal performance. Knowing the tradeoffs of common package technologies, such as HotRod™ and standard wirebond QFN, can help you avoid redesign later. Learn how to pick the correct DC/DC package for optimal thermal design and how to leverage the data sheet parameters before ever having to touch a soldering iron.

其他資訊

arrow-topclosedeletedownloadmenusearchsortingArrowszoom-inzoom-out arrow-downarrow-uparrowCircle-leftarrowCircle-rightblockDiagramcalculatorcalendarchatBubble-doublechatBubble-personchatBubble-singlecheckmark-circlechevron-downchevron-leftchevron-rightchevron-upchipclipboardclose-circlecrossReferencedashdocument-genericdocument-pdfAcrobatdocument-webevaluationModuleglobehistoryClockinfo-circlelistlockmailmyTIonlineDataSheetpersonphonequestion-circlereferenceDesignshoppingCartstartoolsvideoswarningwiki