電子郵件

3.2 Power Loss and Thermal Considerations for Gate Drivers

詳情

日期: 2017年 10月 9日

This presentation discusses power loss, loss distribution, thermal model, thermal analysis and thermal performance comparison in gate driver ICs. This training also discusses thermal performance influencers such as lead frame, substrate, board layout, and operating conditions in gate driver ICs. This presentation shows methodology to perform accurate thermal analysis and accurate thermal comparison in gate driver ICs.

arrow-topclosedeletedownloadmenusearchsortingArrowszoom-inzoom-out arrow-downarrow-uparrowCircle-leftarrowCircle-rightblockDiagramcalculatorcalendarchatBubble-doublechatBubble-personchatBubble-singlecheckmark-circlechevron-downchevron-leftchevron-rightchevron-upchipclipboardclose-circlecrossReferencedashdocument-genericdocument-pdfAcrobatdocument-webevaluationModuleglobehistoryClockinfo-circlelistlockmailmyTIonlineDataSheetpersonphonequestion-circlereferenceDesignshoppingCartstartoolsvideoswarningwiki