注意:各項之間請以逗號分隔

例如 , 09/26/2020

例如 , 09/26/2020

注意:各項之間請以逗號分隔

例如 , 09/26/2020

例如 , 09/26/2020

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55 結果

Touch the Revolution with MSP MCUs featuring CapTIvate™ technology

日期:
2015年 11月 10日

時間長度:
01:05
MSP MCUs with CapTIvate technology offer support for metal touch, the industry's highest resolution sliders and 3D gestures with the world's lowest power.

DLP® 4K Ultra HD Now for Home Theater, Enterprise, and Education

日期:
2016年 1月 8日

時間長度:
00:44
The DLP 4K UHD solution combines speed of the DLP chip with over ten years of image processing experience to deliver accurate, detailed, and razor sharp images.

Capacitive Touch Basics with MSP430 MCUs featuring CapTIvate Technology

This section of the video series provides an introduction to capacitive touch using MSP430 MCUs with CapTIvate technology as well as how to get started with CapTIvate Design Center and CapTIvate development tools.

Fundamental PCB Layout and Design Guidelines of MSP430 MCUs with CapTIvate Technology

This training covers the fundamental design techniques required to implement a successful capacitive sensing hardware design. This series will explore a number of design topics, including:  Basic layout guidelines overlays, back lighting; Dealing with moisture; Self capacitance sensors; Mutual capacitance sensors; and Proximity sensors.

Introduction to EMC Challenges and Design with CapTIvate MCUs

This video series provides a reference on designing capacitive touch capabilities to withstand EMC challenges commonly found in human machine interface applications.

Application Demos of Capacitive Touch Featuring MSP430 MCUs with CapTIvate Technology

Capacitive sensing enables buttons, sliders, wheels and proximity features to be added to a wide-range of applications including building and home access panels and security systems, appliances, personal electronics and more. Watch the videos in this series to get an idea of the capabilities CapTIvate technology can bring to your next application.

BOOSTXL-CAPKEYPAD Capacitive Touch BoosterPack Module Introduction and Demos

This series provides an overview of the BOOSTXL-CAPKEYPAD capacitive touch BoosterPack plug-in module. The BoosterPack features the MSP430FR2522 MCU and allows developers to evaluate capacitive touch capabilities for their next design. The videos provide an overview of the BoosterPack and the out-of-box demos using the CapTIvate Programmer board and the MSP430FR6989 and MSP430F5529 LaunchPad development kits.

TAS5825M Innovation Features Overview

What are the audio amplifier requirements for wireless / AI speaker? How TAS5825M improve battery lifetime and audio quality?

This section provides the overview of TAS5825M innovation features.

TAS5825M Hybrid PWM Modulation to Improve Battery Efficiency

Compared with traditional PWM modulation, TAS5825M develops innovative Hybrid modulation, which dynamically maintains differential switching with several common duty options.

The benefits of Hybrid PWM modulation mainly includes:

  1. Higher efficiency for longer battery lifetime
  2. Good THD+N performance
  3. Ultra-low idle power dissipation and idle noise

TAS5825M Thermal Foldback, Inductor Free and Audio DSP Resource

This training section descripts some innovation features of TAS5825M, which includes:

  1. Real-time thermal foldback: maintain max safe output power for uninterrupted listening experience
  2. 122MHz DSP resource: 192kHz high definition audio processing or Smart Amp algorithm for better speaker protection
  3. Inductor less: state-of-the-art EMI reduction technology
2018 PE webinar series

最新 Type-C 解決方案 ─ 針對消費性電子 Docking/Dongle/Cable

針對USB Type-C的原理、沿革,也針對 USB PD 的規格與應用簡單說明,此次課程尤其針對消費性電子周邊設備 USB Type-C的應用廣泛的介紹相關的應用與其可對應的系統設計。尤其2017年九月 USB 規格升級到 USB 3.2,其相關的規範與設計需要注意的要點,講師也詳細的說明。另外 TI 除了提供USB Type C的相關產品,也提供對應的設計軟體,對系統工程師而言是非常方便的工具,可以大幅縮短設計時間,加速產品上市時間。

2018 PE webinar series

新一代音頻 Class D 功率放大器 ─ 低功耗與優化音質設計指南

講師一開始破題介紹 TI 近兩年來在音頻技術的創新,接續說明客戶如何藉以 TI Audio 技術的優勢進一步的優化其系統的音質與降低系統功耗。對於所有包含 Audio system 的產品而言,例如

2018 PE webinar series

深入剖析電腦與筆電 DC/DC 電源管理設計

針對 PC 與 Notebook 常見的 DC/DC 系統設計進行介紹,說明 TI 在一般消費性電腦與工業電腦 IPC 上常為使用的 Hero Product,另也對於 Buck regulator 、Control topology有詳細的介紹,對於需要進行 DC/DC 電源管理設計的工程師是非常實用的課程。

2018 PE webinar series

擁抱 SSD 應用浪潮 ─ 分享最新 TI 解決方案

針對 SSD 近年的趨勢以及最新的應用與產品做深入淺出的介紹。優質與劣質的 SSD 對終端產品的穩定性與速度有很大的影響,因此在選擇 SSD 的解決方案時更需要注意。講師也針最近熱門的 M.2 Block diagram 和 TI 提供的 SSD 產品與其資源做介紹。

Audio System Hardware with Voice as User Interface

日期:
2017年 5月 17日

時間長度:
24:20
This training identifies the hardware components required to build an application with voice recognition capability.  

Mobile Smart TV introduction and market opportunity

日期:
2017年 1月 10日

時間長度:
11:32
Mobile Smart TV can extend the AV personal electronics category. This video covers value proposition, benefits, and market opportunity in the smart TV category

Mobile Smart TV design considerations (Section A)

日期:
2017年 1月 16日

時間長度:
18:24
Mobile Smart TV Part 2a on-line training:  Mobile Smart TV is a growing category that can extend the AV personal electronics category.

Mobile Smart TV design considerations (Section B)

日期:
2017年 1月 16日

時間長度:
27:01
Design considerations of mobile smart TV including projection technology, style, connectivity, and audio. 
Audio Measurements and Results

Audio THD+N measurements

日期:
2016年 11月 30日

時間長度:
02:49
This video briefly outlines key measurements for audio products, specifically total THD+N and level.

DLP660TE, DLPC4422, DLPA200 Chipset Overview and target display applications

日期:
2017年 4月 27日

時間長度:
07:23
This training highlights the DLP chipset features, how they benefit key digital displays like Laser TVs and digital signage.
55 結果
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