注意:各項之間請以逗號分隔

例如 , 11/27/2021

例如 , 11/27/2021

注意:各項之間請以逗號分隔

例如 , 11/27/2021

例如 , 11/27/2021

排序方式:

971 結果

TI-RSLK MAX Module 6 – GPIO

Explore conversion from light to voltage and voltage to binary; learn to write software to initialize GPIO pins.

TI-RSLK MAX Module 7 – Finite state machines

Use finite state machines as a central controller for the system.

TI-RSLK MAX Module 8 – Interfacing input and output

Develop interface switches and an LED so the robot can effectively detect wall collisions.

TI-RSLK MAX Module 9 – SysTick timer

Learn the fundamentals of SysTick timers and pulse width modulators (PWM).

TI-RSLK MAX Module 11 – Liquid crystal display (LCD)

Learn to display characters and provide real-time debugging on an LCD screen.

TI-RSLK MAX Module 12 – DC motors

Interface the motors to our LaunchPad™ board to make the robot move.

TI-RSLK MAX Module 13 – Timers

Write software that uses the timers to create PWM outputs.

TI-RSLK MAX Module 14 – Real-time systems

Use priority interrupts to create real-time systems.

TI-RSLK MAX Module 15 – Data acquisition systems

Interface the infrared distance sensors using the analog-to-digital converter.

TI-RSLK MAX Module 16 – Tachometer

Interface the tachometers that enable the robot to measure motor rotational speed.

TI-RSLK MAX Module 17 – Control systems

Create a control system by combining the sensors with the actuators.

TI-RSLK MAX Module 18 – Serial communication

Understand the operation and use of first-in, first-out (FIFO) queue to interface robot to the PC using a serial channel.

TI-RSLK MAX Module 19 – Bluetooth® Low Energy (BLE)

Understand basic concepts of Bluetooth® Low Energy (BLE).

TI-RSLK MAX Module 20 – Wi-Fi

Learn how to develop a set of Wi-Fi communications.
Troubleshooting general board clean amplifier FPD Link integrated circuit PCB printed circuit board application linear ADC converter sensor datasheet verification failure analysis debugging debug submission FA customer return DAC audio ABA WCSP

Troubleshooting tips: Board level

This video section gives recommendations and best practices for application debugging techniques at the printed circuit board level.
Troubleshooting general board clean amplifier FPD Link integrated circuit PCB printed circuit board application linear ADC converter sensor datasheet verification failure analysis debugging debug submission FA customer return DAC audio ABA WCSP

Troubleshooting tips: FA submissions

This series gives recommendations and best practices for application debugging techniques during the FA submission process.

TI intern design competition

日期:
2019年 10月 4日

時間長度:
01:44
Texas Instruments college interns enjoy developing robotic solutions using the TI-RSLK MAX

The future of shopping

日期:
2019年 11月 19日

時間長度:
00:13
No more long checkout lines, out-of-stock items or frustrating searches. Sensor-rich stores will make shopping a breeze.

TI 新能源汽车 电池管理系统方案整体介绍

日期:
2019年 12月 6日

時間長度:
32:28
TI 新能源汽车 电池管理系统方案整体介绍
971 結果
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