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例如 , 08/17/2022

例如 , 08/17/2022

注意:各項之間請以逗號分隔

例如 , 08/17/2022

例如 , 08/17/2022

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497 結果

Ask the Expert: How will TI’s C553x low-power DSPs revolutionize the consumer audio market?

日期:
2014年 11月 28日

時間長度:
01:49
How will TI’s C553x ultra-low-power DSPs revolutionize the consumer audio and voice device market? Scott Emley, central marketing manager for the Digital Signal

Getting Started Out of the Box With the TMS320C6748 LCDK

日期:
2016年 1月 20日

時間長度:
02:10
How to start up your TMS320C6748 LCDK so you can quickly and easily begin developing your biometric, analytics, audio and communications-based applications.

Check Out the New Evaluation Module for AM437x Processors

日期:
2014年 11月 8日

時間長度:
03:51
The AM437x Evaluation Module (EVM) enables developers to immediately start evaluating the AM437x processor family.

Getting Started Out of the Box With the TMS320C6748 LCDK

日期:
2016年 1月 20日

時間長度:
02:10
How to start up your TMS320C6748 LCDK so you can quickly and easily begin developing your biometric, analytics, audio and communications-based applications.

Ask the Expert: How does TI's StarterWare suite make TI's ARM® and DSP processors easy to develop?

日期:
2014年 11月 2日

時間長度:
03:26
What is TI's StarterWare software suite, and how does it make TI's ARM® microprocessors, digital signal processors and DSP + ARM processors easy to develop? Hen

Get Started Quickly with Audio Capacitive Touch Boosterpack

日期:
2014年 11月 2日

時間長度:
08:46
The C5535 ultra-low-power DSP-based BoosterPack for the MSP430™ LaunchPad development kit is the 1st solution where the DSP is solely controlled by an MCU

Take a Tour of The New TMDXEVM437X EVM

日期:
2014年 11月 8日

時間長度:
01:30
Take a quick tour of the all new TMDXEVM437X evaluation module featuring the Sitara AM4379 processor with ARM A9 core.

Introducing the TMDSLCDK138 for designs based on OMAP-L138 DSP+ARM8

日期:
2018年 3月 25日

時間長度:
03:04
The new OMAP-L138 LCDK delivers a low-power, low-cost solution for developers to begin their biometric, analytics, audio and communications-based applications.

TI Breaks the $2 DSP Barrier

日期:
2014年 11月 1日

時間長度:
04:37
TI first to break the $2 DSP barrier! Imagine what you could do with a $2 DSP. TMS320C553x ultra-low-power DSPs, the lowest power and lowest cost DSPs in the i

Getting started out of the box with the OMAP-L138 LCDK

日期:
2015年 11月 16日

時間長度:
02:26
Starting up your OMAP-L138 LCDK so you can quickly and easily begin developing your biometric, analytics, audio and communications-based applications.

Take a Tour of the TMS320C6748 LCDK

日期:
2016年 1月 20日

時間長度:
02:43
The TMS320C6748 DSP LCDK is a platform that breaks development barriers for applications that require embedded analytics and real-time signal processing

DM385 IPNC RDK OOB demo

日期:
2014年 11月 3日

時間長度:
25:11
This training is about the DM385 IPNC RDK Out of Box Demo. This video series is split into three parts and each section has a duration of approximately 25 minut

Go Green - Utilize new Linux Power Management API to lower s

日期:
2014年 11月 1日

時間長度:
39:52
Customers are always interested in lowering their system cost. So it is important to point out hardware and software features that have recently become availabl

Graphical Development for C6000 DSP Using C6EZFlo

日期:
2014年 11月 1日

時間長度:
08:28
Software graphical development for TI's C6000(TM) Digital Signal Processors using C6EZFlo

Video Surveillance Reference Design for IP Net Camera and DVR

日期:
2014年 11月 1日

時間長度:
17:52
This session discusses video reference designs based on TI’s DM365 processors and TVP5158 analog decoders.

C5515 Fingerprint Development Kit Overview

日期:
2014年 10月 31日

時間長度:
04:22
In this video, you will be introduced to the new TMS320C5515 Fingerprint Development Kit. The C5515 Fingerprint Development Kit is based on TI's latest C5515 lo

Sitara™ ARM Microprocessor Overview

日期:
2014年 11月 1日

時間長度:
03:59
In this video, you will gain insight into TI’s Sitara™ family of high performance, ARM-based microprocessors (MPUs). The Sitara family further shows TI’s commit

C6000 Code Generation Tools

日期:
2014年 11月 2日

時間長度:
04:49
Overview of the new features in the 7.3 version of TI's C6000 compiler and the upcoming features in the 7.4 version of the compiler.

Android 2.3 (Gingerbread) available for embedded designs

日期:
2014年 11月 2日

時間長度:
02:17
Have questions about using Gingerbread for your embedded design? This video provides an overview of TI's software development kit supporting Android 2.3 - Ging

C5000 Audio Demonstrations at Design West 2012

日期:
2014年 11月 2日

時間長度:
02:05
Achieve crystal clear audio on microcontroller based applications. Watch this video to see TI's latest development platform the C5000 Audio Capacitive Touch Bo
497 結果
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