TI Precision Labs

電子郵件

System design for bottom facing light sensors

描述

2022年 4月 26日
In this video, we will discuss bottom facing light sensors with wafer scale packaging.  This will include advantages such as extremely reduced size and footprint area, and the considerations such as PCB aperture that goes along with it.

其他資訊

arrow-topclosedeletedownloadmenusearchsortingArrowszoom-inzoom-out arrow-downarrow-uparrowCircle-leftarrowCircle-rightblockDiagramcalculatorcalendarchatBubble-doublechatBubble-personchatBubble-singlecheckmark-circlechevron-downchevron-leftchevron-rightchevron-upchipclipboardclose-circlecrossReferencedashdocument-genericdocument-pdfAcrobatdocument-webevaluationModuleglobehistoryClockinfo-circlelistlockmailmyTIonlineDataSheetpersonphonequestion-circlereferenceDesignshoppingCartstartoolsvideoswarningwiki