Experimental power electronics curriculum and reference

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5.5 Thermal aspects of PCBs and vias

描述

2021年 3月 26日
In this lecture, we will learn:
  • PCBs can be useful, effective and low-cost thermal management components.
  • Vertical heat flow through vias is much more effective than lateral heat flow.
  • Because of the high aspect ratio, it can be difficult to treat PCBs as a lumped element.

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