Enhancing power supply performance with the TPSM53604 power module

電子郵件

Unlock improved power module thermal performance with TPSM53604 and Enhanced HotRod™ QFN packaging

描述

2019年 12月 12日
Traditionally, the downside of shrinking power supply solution size has been that thermal performance tends to be degraded. But with the TPSM53604 and Enhanced HotRod™ QFN packaging, this concern is a thing of the past. Watch the video to learn how you can shrink your power module size by 30% compared to a BGA solution, and do so with vastly improved thermal performance.  

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