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1.1 Engineer It: Leverage TI’s online toolbox to tackle thermals before touching a soldering iron

Watch the next video in the series:

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Date: January 25, 2018

For every 10 degrees in junction temperature rise, the chances of your IC failing doubles. With megatrends like increasing power levels, shrinking PCB area, and smaller and smaller package sizes, how can you protect your design against heat and ensure long-term system reliability?

In this thorough training, learn about how to optimize your DC/DC switching regulator design for thermal performance. The LM73605/6 and LM76002/3 synchronous buck converters serve as the example devices. Topics discussed in this video include:

  • Packaging options and what to look for to maximize thermal performance
  • Thermal resistance metrics from the datasheet and what they mean
  • Calculating PCB area requirements for heat sinking